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印能科技 EvoRTS 荣获 2025 R&D 100 Awards全球百大科技研发奖
发布时间:2025年8月27日  发布者:本站编辑

印能科技股份有限公司(AblePrint Technology Corp.)宣布,其创新第四代真空高压高温系统 EvoRTS(Eliminate Void & Residue Terminator System,以下简称RTS),荣获 2025 年度 R&D 100 Awards 全球百大科技研发奖。

R&D 100 Awards 由美国《研发世界》(R&D World)杂志主办,素有「工程界的诺贝尔奖」、「创新界的奥斯卡奖」美誉,每年从全球选出 100 项最具创新与影响力的技术。

RTS采用印能科技最新控制气流波动技术,能在底部填胶(Underfill)固化过程中,有效清除助焊剂残留(Flux Residue)与气泡(Void),可协助助焊剂清洗机缩短清洗时间,更可进一步完全免除水洗、烘干、与电浆清洗等后处理步骤,大幅提升:

制程效率:缩短周期、提升 UPH(单位产出率)
封装良率:减少不良率与返工
永续发展:降低能耗,减少制程碳足迹

目前,RTS已成功导入多家客户验证与量产,应用成果显著。除现有先进封装产品线外,更适合应用在 AI、高效能运算(HPC)等领域,具备高度扩展潜力。

「我们在十多年前就注意到助焊剂残留的问题,直到近年AI-Chiplet的应用快速成长,才让这个解决方案变得迫切。多年来印能持续投入研发资源,最终完善了RTS技术。」

—印能科技董事长 洪 志 宏
他强调,RTS不仅能同时解决大面积芯片封装时的气泡与助焊剂残留难题,更为全球先进封装带来 更绿色、更简化的新方案。

RTS的价值
延伸成熟制程生命周期:无需购买昂贵新设备,即可沿用现有产线,降低先进封装资本支出。
改变游戏规则:简化制程,完全免除繁复的清洗与后处理步骤。
推动制程永续:减少设备投资与能耗,协助客户达成环保与碳中和目标。

印能科技的研发实力已多次获国际专家肯定。公司将持续走在客户需求前端,以专业研发能量解决现有与未来的制程挑战。此次获奖,再度彰显印能在封装制程创新、良率提升与绿色制造方面的深厚实力。

圖片來源:Announcing the 2025 R&D 100 Awards Winners

Press Release
AblePrint’s EvoRTS Wins 2025 R&D 100 Awards as a Top Global Innovation

[Hsinchu, Taiwan – August 25, 2025] –

AblePrint Technology Corp. announced that its innovative fourth-generation vacuum high-pressure and high-temperature system, EvoRTS (Eliminate Void & Residue Terminator System, hereafter RTS), has been honored with the 2025 R&D 100 Awards, recognizing it as one of the world’s top 100 innovations.

The R&D 100 Awards, presented by R&D World magazine since 1963, is widely regarded as the “Nobel Prize of Engineering” and the “Oscars of Innovation.” Each year, it highlights 100 of the most innovative and impactful technologies worldwide.

RTS leverages AblePrint’s latest airflow modulation control technology to effectively remove flux residue and voids during the underfill curing process. The system can not only shorten flux cleaning machine cycles but can even completely eliminate steps such as water cleaning, drying, and plasma cleaning, resulting in significant improvements in:

Process Efficiency: Reduced cycle time and improved UPH (Units Per Hour)
Packaging Yield: Lower defect rates and reduced rework
Sustainability: Reduced energy consumption and minimized carbon footprint

RTS has already been successfully verified and adopted by multiple customers in mass production, with outstanding results. In addition to its application in existing advanced packaging product lines, it is a perfect solution for AI and High-Performance Computing (HPC) packaging applications.

“We recognized the issue of flux residue more than a decade ago. With the rapid rise of AI-Chiplet applications in recent years, addressing this challenge became urgent. Over years of dedicated R&D investment, we perfected the RTS technology.”

— Mr. Horng Chih-Horng, Chairman of AblePrint Technology Corp.
He emphasized that RTS not only solves the dual challenge of flux residue and voids in large-area chip packaging, but also delivers a greener and more simplified solution for global advanced packaging.

Value of RTS
Extending Mature Process Life Cycles: No need for costly new equipment; existing production lines can be leveraged, reducing capital expenditure.

Game-Changer: Streamlined process that eliminates complex cleaning and post-processing steps.
Driving Sustainability: Lower equipment investment and energy consumption help customers achieve carbon neutrality and sustainable manufacturing.

AblePrint’s R&D capabilities have been recognized by international experts multiple times. The company remains committed to staying ahead of customer needs, using unique technological expertise to address both current and future process challenges.

This award once again highlights AblePrint’s leadership in packaging innovation, yield improvement, and sustainable manufacturing.

Would you like me to also prepare a polished PDF or PPT press release version (with company logo, images, and semiconductor-themed background) so it’s ready for distribution to media and partners?

Source:Announcing the 2025 R&D 100 Awards Winners


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